Semiconductor Material Coating Machine
This semiconductor material coating machine features a comma-blade coating head, specifically designed for the coating processes of high-precision materials such as semiconductor materials, photoresists, UV adhesives, electronic materials, and flexible materials.
Product Introduction
Product Details
1. This semiconductor material coating machine utilizes UV curing technology, enabling rapid film formation; the curing process can be completed within a few seconds, thereby significantly enhancing production efficiency.
2. Employing a precisely engraved embossing roller, the equipment imprints a designed pattern onto the incompletely cured coating under specific temperature and pressure conditions. A pressure control system ensures the consistency and integrity of the embossed pattern's depth.
Product Features
Modular Product Series:
Coating methods, drying methods, and functional modules can be selected and configured according to specific requirements.
01
Wide Coating Window:
Adaptable to a variety of coating scenarios, particularly well-suited for production environments involving substrate widths of up to 750 mm and high line speeds.
02
Versatile Coating Modes:
This Coating machine for Pharmaceutical Polymer Composite is Capable of performing both continuous and intermittent coating with high precision.
03
Substrate Tension Control:
Enables stable web handling even under low-tension conditions.
04
Compact Design:
Space-efficient and easy to operate.
05
Product Specifications
|
Coating Type |
Comma Blade |
|
Guide Roller Web Width |
850 mm |
|
Substrate Width |
750 mm |
|
Coating Width |
700 mm |
|
Mechanical Speed |
3 m/min |
|
Coating Speed |
Adjustable via digital settings based on the curing time configuration. |
|
Coating Thickness |
Continuous Coating Single-Side Thickness: 0. 3–0. 4 mm (Determined by the slurry; refer to material requirements) Thickness Accuracy: ≤ ±5 μm (Excluding edge anomaly zones) |
|
Equipment Dimensions |
L 5598 mm × W 1920 mm × H 1584 mm (Subject to actual dimensions) |
Product Advantages
1. This Coating machine for Pharmaceutical Polymer Composite utilizes UV curing, enabling rapid film formation; the curing process can be completed within a few seconds, thereby significantly boosting production efficiency.
2. The system employs a precisely engraved embossing roller to imprint a designed pattern onto the incompletely cured coating under specific temperature and pressure conditions. A pressure control system ensures consistent pattern depth and structural integrity.
Application Fields: Front-end semiconductor manufacturing, advanced packaging, MEMS and sensors, etc.
Hot Tags: semiconductor material coating machine, China semiconductor material coating machine manufacturers, factory
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